Semiconductor device and method for manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsKenshi KAI, Rikihiro Maruyama, Yoshihiro Miyazaki
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Abstract
A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.
Claims10
A semiconductor device comprising:
- an insulated circuit board on which a semiconductor chip is mounted;
- and
- a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.
A method for manufacturing a semiconductor device, comprising:
- mounting a semiconductor chip on an insulated circuit board;
- preparing a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge;
- and
- jointing the insulated circuit board to the housing.
Dependencies are inferred from the claim text.