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US 2019/0157182 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYoshitaka OTSUBO, Yoshitaka KIMURA
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Abstract
A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.
Claims10
A semiconductor device comprising:
- a base plate bonded to a case by means of a bonding agent, wherein
- the base plate includes a heat dissipation metal plate having a heat dissipation property, and a resin insulating layer structured by resin,
- the resin insulating layer is formed on the heat dissipation metal plate,
- the resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed, and
- the case is bonded, by means of the bonding agent, to an exposure part being part of the heat dissipation metal plate and exposed by the notch.
2 more elements
Dependencies are inferred from the claim text.