Heat transfer structures and methods for ic packages

An integrated circuit (IC) package, comprising:

• a substrate comprising a first device and a second device, the first and second device being part of an IC chip;
• an electrical signal path from the first device to a top surface of the IC chip;
• and
• a low thermal resistance path extending from the second device to the top surface of the IC chip,
• wherein
• the low thermal resistance path is electrically isolated from the electrical signal path, and
• the second device is thermally coupled to the first device by a low thermal resistance substrate path.

A package structure comprising:

• a first package layer comprising an electrical signal structure and a first thermal conduction structure electrically isolated from the electrical signal structure;
• a second package layer comprising a second thermal conduction structure;
• and
• a chip layer between the first package layer and the second package layer, the chip layer comprising:
• an integrated circuit (IC) chip electrically coupled to the electrical signal structure, the IC chip comprising:
• a first device and a second device thermally coupled to the first device by a low thermal resistance substrate path,
• wherein the first thermal conduction structure and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.