Case, Semiconductor Apparatus, Method for Manufacturing Case
AssigneeHitachi Automotive Systems, Ltd.
InventorsShinichi FUJINO, Takashi KUBOKI, Masaru KAWAI
Life of this patent
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Abstract
It is possible to improve heat dissipation of a semiconductor circuit to be inserted into a case. A case into which a semiconductor circuit is inserted, the case including: a heat dissipating portion having, on an inner side, a contact surface coming in contact with the semiconductor circuit; a thin portion formed to surround the contact surface and formed to be thinner than the heat dissipating portion; and a recess formed between the thin portion and the heat dissipating portion and recessed with respect to the contact surface, in which an inner surface of the recess is arranged between the contact surface and an inner surface of the thin portion in a thickness direction of the case.
Claims8
A case into which a semiconductor circuit is inserted, the case comprising:
- a heat dissipating portion having, on an inner side, a contact surface coming in contact with the semiconductor circuit;
- a thin portion formed to surround the contact surface and formed to be thinner than the heat dissipating portion;
- and
- a recess formed between the thin portion and the heat dissipating portion and recessed with respect to the contact surface,
- wherein an inner surface of the recess is arranged between the contact surface and an inner surface of the thin portion in a thickness direction of the case.
A semiconductor apparatus comprising:
- a semiconductor circuit having a semiconductor element;
- and
- a case to accommodate the semiconductor circuit,
- wherein the case includes:
- a heat dissipating portion having a contact surface coming in contact with the semiconductor circuit;
- a thin portion formed to surround the contact surface and formed to be thinner than the heat dissipating portion;
- and
- a recess formed between the thin portion and the heat dissipating portion and recessed with respect to the contact surface, and
- an inner surface of the recess is arranged between the contact surface and an inner surface of the thin portion in a thickness direction of the case.
A method for manufacturing a case into which a semiconductor circuit is to be inserted, the method comprising
- forming each of:
- a heat dissipating portion having, on an inner side, a contact surface coming in contact with the semiconductor circuit;
- a thin portion formed to surround the contact surface and formed to be thinner than the heat dissipating portion;
- and a recess formed between the thin portion and the heat dissipating portion and recessed with respect to the contact surface to be arranged so as to allow an inner surface of the recess to be arranged between the contact surface and an inner surface of the thin portion in a thickness direction of the case, so as to be formed individually in the case, and
- performing cutting processing on the contact surface of the case in a state where the case is supported by a jig fixed in the recess.
Dependencies are inferred from the claim text.