Semiconductor device
AssigneeToyota Jidosha Kabushiki Kaisha
InventorNorimune ORIMOTO
Life of this patent
Estimating the term…
Abstract
A semiconductor device may include a semiconductor element; a temperature detecting element provided at a central part of a surface of the semiconductor element, and a heat conductor jointed to the surface of the semiconductor element via a jointing element. The jointing element may include a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element. The heat conductor may include a metal part being in contact with the central part of the jointing element, and a graphite part being in contact with the peripheral part of the jointing element.
Claims4
A semiconductor device comprising:
- a semiconductor element;
- a temperature detecting element provided at a central part of a surface of the semiconductor element;
- and
- a heat conductor jointed to the surface of the semiconductor element via a jointing element,
- wherein
- the jointing element comprises a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element, and
- the heat conductor comprises a metal part being in contact with the central part of the jointing element, and a graphite part being in contact with the peripheral part of the jointing element.
A semiconductor device comprising:
- a semiconductor element;
- a temperature detecting element provided at a central part of a surface of the semiconductor element;
- a heat conductor jointed to the surface of the semiconductor element via a jointing element;
- and
- a plurality of metal wires embedded in the jointing element,
- wherein
- the jointing element comprises a central part positioned over the temperature detecting element, and a peripheral part positioned on a periphery of the central part of the jointing element, and
- the plurality of metal wires is arranged along the peripheral part of the jointing element when viewed in a direction orthogonal to the surface of the semiconductor element.
Dependencies are inferred from the claim text.