Semiconductor device

A semiconductor device comprising:

• a printed wiring board;
• a first semiconductor module including a first package body and a first heat radiation surface, the first package body including a first semiconductor element, the first heat radiation surface being provided on one surface of the first package body and configured to radiate heat generated in the first semiconductor element, the first semiconductor module being disposed such that another surface of the first package body, facing the first heat radiation surface, faces one face of the printed wiring board;
• a first heat radiator provided on the first heat radiation surface of the first semiconductor module;
• a second semiconductor module including a second package body and a second heat radiation surface, the second package body including a second semiconductor element, the second heat radiation surface being provided on one surface of the second package body and configured to radiate heat generated in the second semiconductor element, the second semiconductor module being disposed such that another surface of the second package body, facing the second heat radiation surface, faces another face of the printed wiring board;
• and
• a second heat radiator provided on the second heat radiation surface of the second semiconductor module,
• wherein
• the first semiconductor module and the second semiconductor module are arranged to overlap each other in a plan view, and
• the second semiconductor module is connected in parallel to the first semiconductor module.