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US 2019/0157176 A1Published application
Semiconductor packages having dual encapsulation material
AssigneeSTMicroelectronics (Malta) Ltd
InventorsDavid BONNICI, Brenda FARRUGIA
Life of this patent
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Abstract
One or more embodiments are directed to a semiconductor package that includes transparent encapsulation material and an opaque encapsulation material. In one embodiment, the opaque encapsulation material is thicker than the transparent encapsulation material; however, the outer surfaces of the opaque and the transparent encapsulation materials are coplanar with each other.
Claims20
A semiconductor package comprising:
- a substrate having a center portion and a perimeter portion, the perimeter portion having first and second thicknesses that are different from each other, at least one of the first and second thicknesses being less than a third thickness of the center portion;
- a first die of semiconductor material mounted to the substrate at the center portion;
- a transparent encapsulation material on the center portion of the substrate and around the first die;
- and
- an opaque encapsulation material on the perimeter portion of the substrate.
2 more elements
A semiconductor package comprising:
- a substrate having a center portion and a perimeter portion around the center portion, at least one side of the semiconductor package at the perimeter portion having a first portion with a first thickness and a second portion with a second thickness, the first and second thicknesses being less than a third thickness of the center portion;
- a first die of semiconductor material mounted to the substrate at the center portion, the first die including an optical component;
- conductive elements electrically coupling the first die to electrical components of the substrate;
- a transparent encapsulation material on the center portion of the substrate and around the first die;
- and
- an opaque encapsulation material on the first and second portions of the perimeter portion of the substrate and having a different thickness on the first portion than on the second portion, the opaque encapsulation material having outer surfaces that are coplanar with outer surfaces of the transparent encapsulation material.
3 more elements
13-20. (canceled)
An electronic device comprising:
- a controller;
- and
- a semiconductor package coupled to the controller, the semiconductor package including:
- a substrate having a first portion having a first thickness and a second portion having a second thickness, the first and second portions being at a perimeter of the substrate, wherein the first thickness is greater than the second thickness, wherein both the first and second portions of the substrate are exposed on at least one side of the semiconductor package;
- a first die of semiconductor material coupled to the substrate at central portion;
- a transparent encapsulation material encapsulating the first die and abutting the central portion of the substrate;
- and
- an opaque encapsulation material over the first and second portions of the substrate and along side surfaces of the transparent encapsulation material, the opaque encapsulation material being thinner over the first portion of the substrate than over the second portion of the substrate, the opaque encapsulation material being thicker than the transparent encapsulation material.
5 more elements
Dependencies are inferred from the claim text.