Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating

A method of forming a semiconductor package, the method comprising:

• providing a first packaged semiconductor device, the first packaged semiconductor device comprising a first semiconductor die comprising a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound;
• and
• forming a conductive track in the outer surface of the first mold compound, wherein forming the conductive track comprises:
• activating a portion of the outer surface of the first mold compound for an electroless plating process;
• and
• performing the electroless plating process so as to form an electrically conductive material only within the activated portion of the outer surface of the first mold compound.