Passive components in vias in a stacked integrated circuit package
AssigneeIntel Corporation
InventorsSujit SHARAN, Ravindranath MAHAJAN, Stefan RUSU, Donald S. GARDNER
Life of this patent
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Abstract
Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, a via through the first die, and a passive device formed in the via of the first die and coupled to the power supply circuit.
Claims20
A method comprising:
- forming a plurality of vias in a silicon wafer;
- forming passive devices in a portion of the plurality of vias;
- forming power supply circuits on the silicon wafer after forming the passive devices;
- dicing the silicon wafer to produce a plurality of uncore dies each having a power supply circuit;
- attaching one of the plurality of uncore dies to a substrate;
- and
- attaching a cores die having a processing core to the uncore die, the cores die over the uncore die, the cores die being coupled to the power supply circuit through the passive devices of the uncore die to power the processing core.
A method comprising:
- forming a plurality of vias in a silicon wafer;
- forming passive devices in or on the silicon wafer;
- forming power supply circuits on the silicon wafer from the passive devices;
- dicing the silicon wafer to produce a plurality of uncore dies each having a power supply circuit;
- attaching one of the plurality of uncore dies to a substrate;
- and
- attaching a cores die having a processing core to the uncore die, the cores die over the uncore die, the cores die being coupled to the power supply circuit through the passive devices of the uncore die to power the processing core.
Dependencies are inferred from the claim text.