Wafer processing method
AssigneeDisco Corporation
InventorKazuma SEKIYA
Life of this patent
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Abstract
A wafer processing method for forming cut grooves in streets of a wafer provided with a plurality of devices includes a holding step ST1 of holding the back surface side of the wafer by a holding surface of a chuck table, a measurement step ST2 of partitioning the front surface of the wafer held by the chuck table into a plurality of regions and measuring the surface height of the streets in each of the regions, a region-basis height setting step ST3 of setting the lowest surface height in each region as the surface height of the wafer in each region, and a cutting step ST4 of forming cut grooves in the front surface of the wafer while setting, on a region basis, a tip position of a cutting blade, based on the surface height of the wafer set in the region-basis height setting step ST3.
Claims2
A wafer processing method for forming cut grooves by a cutting blade in streets of a wafer provided on a front surface thereof with the streets and a plurality of devices, the streets formed in a grid pattern and partly formed with a structure, the wafer processing method comprising:
- a holding step of holding a back surface side of the wafer by a holding surface of a chuck table;
- a measurement step of partitioning the front surface of the wafer held by the chuck table into a plurality of regions and measuring surface heights of the streets in each of the regions;
- a region-basis height setting step of setting a lowest surface height in each region as a surface height of the wafer in each region, after the measurement step is performed;
- and
- a cutting step of forming cut grooves in the front surface of the wafer while setting, on a region basis, a tip position of the cutting blade cutting into the wafer, based on the surface height of the wafer set in the region-basis height setting step.
Dependencies are inferred from the claim text.