Methods of fabricating semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorsSungwoo MYUNG, GeumJung SEONG, Jisoo OH, JinWook LEE, Dohyoung KIM, Yong-Ho JEON
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AssigneeSamsung Electronics Co., Ltd.
InventorsSungwoo MYUNG, GeumJung SEONG, Jisoo OH, JinWook LEE, Dohyoung KIM, Yong-Ho JEON
Estimating the term…
A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.
-32. (canceled)
A method of fabricating a semiconductor device, the method comprising:
A method of fabricating a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.