Dual-purpose vias for use in ceramic pedestals
AssigneeWatlow Electric Manufacturing Company
InventorsMohammad NOSRATI, Kevin PTASIENSKI
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Abstract
A ceramic pedestal assembly and a method of forming a ceramic pedestal assembly is provided. The ceramic pedestal assembly includes a ceramic substrate defining an upper surface and a lower surface, at least one via extending through the ceramic substrate, an upper conductive foil layer extending across the upper surface of the ceramic substrate and a lower conductive foil layer extending across the lower surface of the ceramic substrate. Each via includes an upper via defining a cavity and a lower via defining a corresponding tapered insert. In one form, the upper via, the lower via, and the conductive foil layers define a material having a melting temperature greater than 2,000° C. and a CTE less than or equal to the ceramic substrate.
Claims20
A ceramic pedestal assembly comprising:
- a substrate having a first functional layer and a second functional layer, the first and second functional layers disposed at opposite sides of the substrate;
- and
- at least one via extending through the substrate comprising:
- an upper via defining a cavity;
- and
- a lower via defining a corresponding insert,
- wherein the first functional layer, the second functional layer, and the at least one via define a material having a melting temperature greater than 2,000° C. and a CTE lower than the substrate.
A ceramic pedestal assembly comprising:
- a ceramic substrate defining an upper surface and a lower surface;
- an upper conductive foil layer extending across the upper surface of the ceramic substrate;
- a lower conductive foil layer extending across the lower surface of the ceramic substrate;
- and
- at least one via extending through the ceramic substrate, the at least one via comprising:
- an upper via defining a tapered cavity;
- and
- a lower via defining a corresponding tapered insert,
- wherein the at least one via and the upper and lower conductive foil layers define a material having a melting temperature greater than 2,000° C. and a CTE lower than the ceramic substrate.
A method of forming a ceramic pedestal assembly comprising:
- forming a ceramic substrate in a green state with at least one aperture;
- placing an upper via defining a cavity through an upper surface of the ceramic substrate;
- placing a lower via defining a corresponding insert through a lower surface of the ceramic substrate;
- placing an upper functional layer across the upper surface of the ceramic substrate;
- placing a lower functional layer extending across the lower surface of the ceramic substrate;
- and
- hot pressing the assembly in a uniaxial direction,
- wherein the upper via, the lower via, and the functional layers define a material having a melting temperature greater than 2,000° C. and a CTE less than or equal to the ceramic substrate.
Dependencies are inferred from the claim text.