Wafer carrier having thermal cover for chemical vapor deposition systems
OwnerAlexander I. Gurary, Eric Armourinventors
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Abstract
The invention relates generally to semiconductor fabrication technology and, more particularly, to chemical vapor deposition (CVD) processing and associated apparatus for addressing temperature non-uniformities on semiconductor wafer surfaces. Embodiments include a wafer carrier for use in a system for growing epitaxial layers on one or more wafers by CVD, the wafer carrier comprising a top plate and base plate which function coordinately to reduce temperature variability caused during CVD processing.
Claims5
1-16. (canceled)
A method for reducing temperature non-uniformities affecting a characteristic of a device formed in a chemical vapor deposition (CVD) tool, the method comprising:
- forming a base plate that includes surface portions arranged to support each of a plurality of wafers,
- forming a top plate having a size and shape that fits over portions of the base plate that do not reside beneath any of the plurality of wafers;
- removably securing the top plate to the bottom plate to produce a relative arrangement of the base plate, top plate, and the plurality of wafers in which a more uniform thermal insulating characteristic over the surface of each one of the plurality of wafers during CVD processing is provided compared to an arrangement lacking the top plate.
Dependencies are inferred from the claim text.