System and method for annealing die and wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsin-Hao YEH
Life of this patent
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Abstract
A method for annealing a semiconductor die is provided. Information regarding layout of the semiconductor die is received. At least one annealing orbit on the semiconductor die is obtained according to the received information. An alignment procedure is performed on a plurality of alignment marks of the semiconductor die according to the received information. The semiconductor die is positioned according to the alignment marks. A laser beam with a first laser parameter is projected onto the positioned semiconductor die along the annealing orbit, so as to anneal a first portion of the positioned semiconductor die covered by the annealing orbit. The positioned semiconductor die is partially covered by the annealing orbit.
Claims20
A method for annealing a semiconductor die, comprising:
- receiving information regarding layout of the semiconductor die;
- obtaining at least one annealing orbit on the semiconductor die according to the received information;
- performing an alignment procedure on a plurality of alignment marks of the semiconductor die according to the received information;
- positioning the semiconductor die according to the alignment marks;
- and
- projecting a laser beam with a first laser parameter onto the positioned semiconductor die along the annealing orbit, so as to anneal a first portion of the positioned semiconductor die covered by the annealing orbit,
- wherein the positioned semiconductor die is partially covered by the annealing orbit.
A system for annealing a wafer, comprising:
- a wafer stage;
- a laser beam generator configured to generate a laser beam;
- and
- a controller configured to control the laser beam generator according to information regarding layout of a first semiconductor die of the wafer, so as to project the laser beam with a first laser parameter onto the first semiconductor die of the wafer on the wafer stage along at least one annealing orbit,
- wherein the controller is configured to arrange the annealing orbit to partially cover the first semiconductor die of the wafer and to uncover second semiconductor dies of the wafer.
A method for annealing a wafer, comprising:
- receiving information regarding layout of a first semiconductor die of the wafer;
- obtaining at least one annealing orbit on the first semiconductor die according to the received information;
- and
- projecting a laser beam with a first laser parameter onto the first semiconductor die along the annealing orbit, so as to anneal a first portion of the first semiconductor die covered by the annealing orbit,
- wherein the first semiconductor die of the wafer is partially covered by the annealing orbit, and second semiconductor dies of the wafer are uncovered by the annealing orbit.
Dependencies are inferred from the claim text.