Substrate treatment method and substrate treatment device

A substrate processing apparatus comprising:

• a substrate holding unit that rotates a substrate about a vertical rotation axis passing through the substrate while holding the substrate horizontally;
• a brush to be pressed against the substrate;
• a brush moving mechanism that moves the brush to a plurality of positions including a lower contact position in which the brush contacts with a lower surface inclined portion of the substrate and an upper contact position in which the brush contacts with an upper surface inclined portion of the substrate;
• a nozzle that forms a plurality of liquid droplets that collide with an upper surface of the substrate;
• a nozzle moving mechanism that moves a collision position of the plurality of liquid droplets with respect to the upper surface of the substrate between a center of the substrate and an outer circumference of the substrate;
• and
• a controller that controls the substrate holding unit, the brush moving mechanism and the nozzle moving mechanism,
• wherein the controller conducts:
• a substrate rotating step of causing the substrate holding unit to hold the substrate horizontally and to rotate the substrate about the rotation axis;
• a lower side scrub cleaning step of causing the brush moving mechanism to bring the brush into contact with the lower surface inclined portion of the substrate, in parallel with the substrate rotating step;
• a center side spray cleaning step of causing the nozzle moving mechanism to move the collision position of the plurality of liquid droplets with respect to the upper surface of the substrate between the center of the substrate and a middle of the substrate while causing the plurality of liquid droplets to collide with the upper surface of the substrate, in parallel with the lower side scrub cleaning step;
• an upper side scrub cleaning step of causing the brush moving mechanism to bring the brush to come into contact with the upper surface inclined portion of the substrate, after the lower side scrub cleaning step and in parallel with the substrate rotating step;
• and
• an outer circumference side spray cleaning step of causing the nozzle moving mechanism to move the collision position of the plurality of liquid droplets with respect to the upper surface of the substrate between the middle of the substrate and the outer circumference of the substrate while causing the plurality of liquid droplets to collide with the upper surface of the substrate, in parallel with the upper side scrub cleaning step.