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US 2019/0157112 A1Published application
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
AssigneeMicron Technology, Inc.
InventorsShijian Luo, Jonathan S. Hacker
Life of this patent
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Abstract
A semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces, wherein the prefill material directly contacts peripheral surfaces of the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
Claims17
A semiconductor device, comprising:
- a substrate including traces, wherein the traces protrude above a top surface of the substrate;
- a prefill material over the substrate and between the traces, wherein the prefill material directly contacts peripheral surfaces of the traces;
- a die attached over the substrate;
- and
- a wafer-level underfill between the prefill material and the die, wherein at least one of the wafer-level underfill and the prefill material is cured with the wafer-level underfill and the prefill material persisting as separate layers after curing.
2 more elements
A method of manufacturing a semiconductor device, comprising:
- providing a substrate including traces, wherein the traces protrude above a top surface of the substrate;
- forming a prefill material over the substrate and between the traces based on applying a nonconductive paste (NCP) between the traces, wherein the prefill material directly contacts peripheral surfaces of the traces;
- and
- attaching an interim structure to the substrate over the prefill material, wherein the interim structure includes a die and a wafer-level underfill between the die and the prefill material.
1 more element
(canceled)
Dependencies are inferred from the claim text.