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US 2019/0157109 A1Published application
Method of production of a structure including a high thermal conductivity substrates and devices on it
AssigneeIcdat Ltd. 5
InventorsJOSEPH KAPLUN, Adam Hoffman
Life of this patent
Estimating the term…
Abstract
There may be provided a method for generating a structure, the method may include receiving multiple donor structures that comprise multiple mesas; placing the multiple donor structures on a substrate that lacks a semiconductor layer that covers the entire substrate; and performing a manufacturing process that comprises coupling the multiple mesas to the substrate.
Claims18
A method for generating a structure, the method comprises:
- receiving multiple donor structures that comprise multiple mesas;
- placing the multiple donor structures on a substrate that lacks a semiconductor layer that covers the entire substrate;
- and
- performing a manufacturing process that comprises coupling the multiple mesas to the substrate.
1 more element
A structure that comprises mesas that are electrically coupled to a substrate, wherein the structure is manufactured by (a) receiving multiple donor structures that comprise multiple mesas;
- (b) placing the multiple donor structures on a substrate that lacks a semiconductor layer that covers the entire substrate;
- and (c) performing a manufacturing process that comprises coupling the multiple mesas to the substrate.
Dependencies are inferred from the claim text.