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US 2019/0157107 A1Published application
Low surface roughness substrate having a via and methods of making the same
AssigneeCorning Incorporated
InventorYuhui Jin
Life of this patent
Estimating the term…
Abstract
Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.
Claims14
A method of forming substrates with a via, the method comprising:
- etching a damage region in a stack to form a via in the stack,
- wherein the stack comprises a plurality of substrates including a first substrate and at least one additional substrate,
- wherein each of the plurality of substrates has at least one surface removably bonded to a surface of another of the plurality of substrates,
- wherein the damage region extends through the entire thickness of the at least one additional substrate, and the etching forms a through via in the at least one additional substrate,
- wherein the etching forms a blind via in the first substrate, and
- the at least one surface of each of the plurality of substrates removably bonded to the surface of another of the plurality of substrates has a surface roughness (Ra) of less than or equal to about 0.6 nm upon debonding the plurality of substrates.
3 more elements
A stack, comprising:
- a plurality of substrates including a first substrate and at least one additional substrate;
- at least one blind via in the first substrate;
- and
- at least one through via in the at least one additional substrate,
- wherein each of the plurality of substrates has a surface removably bonded to a surface of another one of the plurality of substrates, and
- wherein the surface of each of the plurality of substrates removably bonded to a surface of another one of the plurality of substrates has a surface roughness (Ra) of less than or equal to about 0.6 nm upon debonding the plurality of substrates.
3 more elements
Dependencies are inferred from the claim text.