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US 2019/0157101 A1Published application
Self-assembled monolayer blocking with intermittent air-water exposure
AssigneeApplied Materials, Inc.
InventorsTobin KAUFMAN-OSBORN, Keith Tatseun WONG
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Abstract
Implementations described herein generally relate to processes for the fabrication of semiconductor devices in which a self-assembled monolayer (SAM) is used to achieve selective area deposition. Methods described herein relate to alternating SAM molecule and hydroxyl moiety exposure operations which may be utilized to form SAM layers suitable for blocking deposition of subsequently deposited materials.
Claims12
1-20. (canceled)
A method of processing a substrate, comprising:
- simultaneously exposing a substrate to a self-assembled monolayer (“SAM”) molecule and a hydroxyl moiety for a first period of time to achieve selective deposition of a SAM on a first material, wherein the substrate comprises an exposed first material and an exposed second material;
- repeating the simultaneously substrate to a self-assembled monolayer (“SAM”) molecule and a hydroxyl moiety for a second period of time to achieve selective deposition of a SAM on the first material;
- selectively depositing a third material on the exposed second material;
- and
- removing the SAM from the first material.
2 more elements
Dependencies are inferred from the claim text.