Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

A mounting structure of a circuit board having a multilayered ceramic capacitor mounted thereon, the mounting structure comprising:

• a printed circuit board having first and second electrode pads formed thereon;
• and
• a multilayered ceramic capacitor mounted on the printed circuit board,
• the multilayered ceramic capacitor including:
• a ceramic body having a plurality of dielectric layers laminated therein;
• an active layer including a plurality of first and second internal electrodes having the dielectric layer interposed therebetween, the first and second internal electrodes being alternately exposed through both end surfaces of the ceramic body;
• an upper cover layer formed above the active layer;
• a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer and having at least one pair of first and second internal electrodes alternately exposed through both end surfaces thereof;
• and
• first and second external electrodes formed on both end surfaces of the ceramic body to be electrically connected to exposed portions of the first and second internal electrodes and soldering-connected to first and second electrode pads,
• 1wherein E/B≤0.5 in which B is a thickness of the lower cover layer, E is an overall thickness of the first and second internal electrodes formed inside the lower cover layer and E/B is a ratio of the overall thickness (E) of the first and second internal electrodes formed inside the lower cover layer to the thickness (B) of the lower cover layer, and
• wherein F is 100 μm or smaller, in which F is a thickness from a lowermost edge of the first or second internal electrode formed inside the lower cover layer to a bottom surface of the ceramic body.

A packing unit for a multilayered ceramic capacitor, the packing unit comprising:

• one or more multilayered ceramic capacitors, the one or more multilayered ceramic capacitors including:
• a ceramic body having a plurality of dielectric layers laminated therein;
• an active layer including a plurality of first and second internal electrodes having the dielectric layer interposed therebetween, the first and second internal electrodes being alternately exposed through both end surfaces of the ceramic body;
• an upper cover layer formed above the active layer;
• a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer and having at least one pair of first and second internal electrodes alternately exposed through both end surfaces thereof;
• and
• first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes,
• wherein E/B≤0.5, in which B is a thickness of the lower cover layer, E is an overall thickness of the first and second internal electrodes formed inside the lower cover layer and E/B is a ratio of the overall thickness (E) of the first and second internal electrodes formed inside the lower cover layer to the thickness (B) of the lower cover layer, and wherein F is 100 μm or smaller, in which F is a thickness from a lowermost edge of the first or second internal electrode formed inside the lower cover layer to a bottom surface of the ceramic body;
• and
• a packing sheet having a plurality of receiving parts in which the multilayered ceramic capacitors are respectively received, the lower cover layer of the multilayered ceramic capacitor facing a bottom surface of the receiving part.