Composite electronic component and board having the same

A composite electronic component comprising a composite body including:

• a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and first and second external electrodes disposed on the lower surface of the first ceramic body;
• and
• a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively, a first via electrode penetrating through the second ceramic body to thereby be connected to the first terminal electrode, and a second via electrode penetrating through the second ceramic body to thereby be connected to the second terminal electrode,
• wherein the first and second internal electrodes include first and second leads exposed to the lower surface of the first ceramic body, respectively, and
• wherein the first and second leads are spaced apart from each other by a first predetermined interval, and the first and second via electrodes are spaced apart from each other by a second predetermined interval.