Resin molded substrate and mounting structure for capacitor
AssigneeFanuc Corporation
InventorsYuuki INOUE, Masaya TATEDA
Life of this patent
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Abstract
A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.
Claims6
A resin molded substrate for allowing a cylindrical capacitor to be mounted in an upright state with a solder, the capacitor having a pair of lead terminals at a bottom portion, the resin molded substrate comprising:
- at least a pair of terminal through holes for allowing the lead terminals of the capacitor to be inserted through, respectively;
- and
- at least one protrusion for spacing the capacitor from a front surface of the substrate, under being in contact with a side of the bottom portion of the capacitor, the lead terminals of the capacitor being inserted through the terminal through holes.
Dependencies are inferred from the claim text.