Electronic component and method of manufacturing electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKoichi YAMAGUCHI, Koshi HIMEDA
Life of this patent
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Abstract
An electronic component comprising a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil; and a mold resin sealing the coil component. The electronic component further comprises an electrode film in contact with an outer surface of the mold resin; and a connection conductor disposed in the mold resin and electrically connecting the external electrode and the electrode film.
Claims6
An electronic component comprising:
- a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil;
- a mold resin sealing the coil component;
- an electrode film in contact with an outer surface of the mold resin;
- and
- a connection conductor disposed in the mold resin and electrically connecting the external electrode and the electrode film.
A method of manufacturing an electronic component comprising:
- sealing a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil, with a mold resin;
- and
- disposing an electrode film in contact with one principal surface of the mold resin, making a hole from the one principal surface of the mold resin toward one principal surface of the coil component, and disposing a connection conductor in the hole to electrically connect the external electrode and the electrode film.
A method of manufacturing an electronic component comprising:
- placing a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil, on a connection conductor disposed on one principal surface of a substrate to electrically connect the external electrode and the connection conductor;
- sealing the coil component with a mold resin on the one principal surface side of the substrate;
- and
- exposing the connection conductor from an end surface of the mold resin and disposing an electrode film in contact with the mold resin and in contact with the connection conductor.
Dependencies are inferred from the claim text.