Method of forming conductive grid of integrated circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHIRANMAY BISWAS, KUO-NAN YANG, CHUNG-HSING WANG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHIRANMAY BISWAS, KUO-NAN YANG, CHUNG-HSING WANG
Estimating the term…
A method of forming an integrated circuit includes: forming a conductive grid on a semiconductor substrate; selecting a plurality of first conductive lines from a plurality of non-continuous conductive lines according to a first mask layer assigned to the plurality of first conductive lines; selecting a plurality of second conductive lines from the plurality of non-continuous conductive lines according to a second mask layer assigned to the plurality of second conductive lines, wherein the second mask layer different from the first mask layer, and the plurality of second conductive lines is electrically connected to the plurality of first conductive lines via the plurality of continuous conductive lines; and replacing the plurality of second conductive lines by a plurality of third conductive lines respectively, wherein the plurality of third conductive lines is assigned to the first mask layer.
A method of forming an integrated circuit:
A method of forming an integrated circuit:
A system, comprising:
Dependencies are inferred from the claim text.