Back to results
US 2019/0155154 A1Published application
Ruggedized solder mask material
AssigneeInternational Business Machines Corporation
InventorsMatthew Kelly, Mark Jeanson, Joseph Kuczynski
Life of this patent
Estimating the term…
Abstract
Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.
Claims20
A solder mask formulation, comprising:
- a liquid photo imageable solution;
- and
- a solution of functionalized diamondoids, wherein the functionalized diamondoids are configured to crosslink with a resin formed by the liquid photo imageable solution and other functionalized diamondoids upon exposure to actinic radiation.
(canceled)
A solder mask formulation comprising:
- a photoinitiator representing approximately 0% to approximately 30% by weight of the solder mask formulation;
- a functionalized diamondoid solution representing approximately 10% to approximately 50% by weight of the solder mask formulation;
- an ether representing approximately 10% to approximately 30% by weight of the solder mask formulation;
- an aromatic representing approximately 0% to approximately 10% by weight of the solder mask formulation;
- a sulfate representing approximately 10% to approximately 30% by weight of the solder mask formulation;
- an acetate representing approximately 0% to approximately 10% by weight of the solder mask formulation;
- and
- one or more acrylates each representing approximately 1% to approximately 30% by weight of the solder mask formulation, wherein functionalized diamondoids of the functionalized diamondoid solution are configured to crosslink with a resin formed by the liquid photo imageable solution and other functionalized diamondoids upon exposure to actinic radiation.
5 more elements
A semiconductor fabrication method comprising:
- applying a solder mask formulation to a semiconductor device, the solder mask formulation comprising:
- a liquid photo imageable solution;
- and
- a solution of functionalized diamondoids, wherein the functionalized diamondoids are configured to crosslink with a resin formed by the liquid photo imageable solution and other functionalized diamondoids upon exposure to actinic radiation.
1 more element
(canceled)
Dependencies are inferred from the claim text.