Systems and methods of testing multiple dies
AssigneeTexas Instruments Incorporated
InventorsRubin Ajit Parekhji, Mahesh M. Mehendale, Vinod Menezes, Vipul K. Singhal
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Abstract
In a method of testing a semiconductor wafer including a scribe line and multiple dies, the method includes implementing a first landing pad on the scribe line, and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip, and applying an ATE resource to the first cluster of dies.
Claims28
A method of testing a semiconductor wafer including a scribe line and a plurality of dies, the method comprising:
- contacting a landing pad with a probe tip, the landing pad implemented on the scribe line, the landing pad separate from pads on the dies, the probe tip electrically coupled to an automated test equipment (ATE);
- and
- applying, using the ATE, an ATE resource, via the landing pad, to at least two of the dies to test circuitry electrically coupled to the pads on the at least two of the dies, the circuitry electrically coupled to the landing pad via an interconnect implemented on the scribe line.
A system for testing a plurality of semiconductor dies, the system comprising:
- a semiconductor wafer including:
- a scribe line between at least two of the dies;
- a landing pad on the scribe line;
- and an interconnect on the scribe line extending along a length of the scribe line between edges of adjacent ones of at least two of the dies in a group of the dies, the interconnect configured to electrically couple the landing pad to the group of the dies;
- and
- a probe tip electrically coupled to automated test equipment (ATE) and configured to:
- contact the landing pad;
- and apply an ATE resource to the at least two of the dies via the landing pad to test the group of the dies.
A method of testing first and second devices under test using automated device equipment (ATE), the method comprising:
- performing concurrent testing of the first and second devices under test by:
- contacting each of the first and second devices under test with probe tips electrically coupled to the ATE;
- and
- applying a first ATE resource to the first device under test while applying a second ATE resource to the second device under test as a result of the ATE lacking a sufficient amount of the first ATE resource to apply the first ATE resource to the first and second devices under test concurrently.
A system for testing first and second devices under test, the system comprising:
- a plurality of probe tips electrically coupled to automated test equipment (ATE) and configured to:
- contact each of the first and second devices under test;
- and
- apply a first ATE resource to the first device under test while applying a second ATE resource to the second device under test as a result of the ATE lacking a sufficient amount of the first ATE resource to apply the first ATE resource to the first and second devices under test concurrently.
A semiconductor wafer comprising:
- a first die;
- a second die spaced apart from the first die;
- and
- an interconnect, extending along a scribe line space between facing sides of the first and second dies, to electrically couple a probe tip landing pad to the first and second dies, the probe tip landing pad being positioned on the scribe line space.
Dependencies are inferred from the claim text.