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US 2019/0154729 A1Published application
Apparatus and method for packaging, handling or testing of sensors
AssigneeRosemount Aerospace Inc.
InventorsJim Golden, David P. Potasek, Marcus Allen Childress
Life of this patent
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Abstract
A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
Claims10
A sensor assembly comprising:
- a flexible circuit that includes a flexible substrate that forms a body portion of the sensor assembly and pads positioned on the flexible circuit;
- a sensor positioned on the flexible circuit;
- and
- wire bonds connecting the sensor to the pads on the flexible circuit.
1 more element
A test sheet comprising:
- an array of sensor assembly dies, wherein each sensor assembly die comprises:
- a sensor assembly;
- a frame surrounding the sensor assembly;
- and
- a plurality of tabs connecting the sensor assembly to the frame;
- a plurality of test pads;
- and
- a plurality of electrical traces, wherein each electrical trace connects a sensor assembly to one test pad.
5 more elements
Dependencies are inferred from the claim text.