Substrate processing apparatus, substrate processing method, and storage medium
AssigneeTokyo Electron Limited
InventorShinichiro Misaka
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.
Claims13
A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate, the apparatus comprising:
- a plurality of heating control regions that are set along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature;
- and
- an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.
A substrate processing method comprising:
- detecting deformation of a substrate different in height from a plane orthogonal to a center axis of the substrate in a circumferential direction,
- adjusting a relative direction of the circumferential direction of the substrate with respect to an arrangement of a circumferential direction of a plurality of heating control regions, by using the plurality of heating control regions that are set along a circumferential direction of a placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, based on the detection result obtained in the detecting that detects deformation of the substrate, and
- heating the substrate in a state where the relative direction of the circumferential direction of the substrate is adjusted.
Dependencies are inferred from the claim text.