Polishing method and polishing composition
AssigneeFujimi Incorporated
InventorsSHUHEI TAKAHASHI, MASATOSHI TOMATSU
Life of this patent
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Abstract
Provided is a method for polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing method comprises a step of carrying out preliminary polishing using a preliminary polishing composition that comprises an abrasive APRE and a step of carrying out final polishing using a final polishing composition that comprises an abrasive AFIN lower in hardness than the abrasive APRE.
Claims17
A method for polishing, comprising the steps of:
- preliminarily polishing a material using a polishing pad and a preliminary polishing composition, the material having a Vickers hardness of 1500 Hv or higher;
- and
- carrying out final polishing of the material using a polishing pad and a final polishing composition;
- wherein the preliminary polishing composition comprises an abrasive APRE, and the final polishing composition comprises an abrasive AFIN lower in hardness than the abrasive APRE.
A method for polishing, comprising the steps of:
- preliminarily polishing a material using a polishing pad and a preliminary polishing composition, the material having a Vickers hardness of 1500 Hv or higher;
- and
- carrying out final polishing of the material using a polishing pad and a final polishing composition,
- wherein the preliminary polishing composition has an oxidation-reduction potential ORPPRE vs. standard hydrogen electrode, and the final polishing composition has an oxidation-reduction potential ORPFIN vs. standard hydrogen electrode, satisfying a relation ORPPRE>ORPFIN.
A method for polishing, comprising the steps of:
- preliminarily polishing a material using a polishing pad and a preliminary polishing composition that comprises an abrasive APRE, the material having a Vickers hardness of 1500 Hv or higher;
- and
- carrying out final polishing of the material using a polishing pad and a final polishing composition that comprises an abrasive AFIN,
- wherein the preliminary polishing composition has a standard polishing removal rate RPRE on a SiC wafer, and the final polishing composition has a standard polishing removal rate RFIN on the SiC wafer, satisfying a relation RPRE>RFIN.
A polishing composition kit comprising:
- a preliminary polishing composition comprising an abrasive APRE;
- and
- a final polishing composition;
- wherein the final polishing composition comprises an abrasive AFIN, and a water-soluble polishing aid BFIN comprising a composite metal oxide CMOFIN,
- the composite metal oxide CMOFIN has a monovalent or divalent metal (but not a transition metal) or ammonia, and a transition metal in group 5 of the periodic table, and
- the abrasive AFIN is lower in hardness than the abrasive APRE.
A polishing composition kit comprising:
- a preliminary polishing composition having an oxidation-reduction potential ORPPRE versus standard hydrogen electrode;
- and
- a final polishing composition having an oxidation-reduction potential ORPFIN versus standard hydrogen electrode;
- wherein ORPPRE>ORPFIN.
A polishing composition kit comprising:
- a preliminary polishing composition having a standard polishing removal rate RPRE on a SiC wafer;
- and
- a final polishing composition having a standard polishing removal rate RFIN on the SiC wafer, wherein RPRE>RFIN;
- wherein the final polishing composition comprises a water-soluble polishing aid BFIN comprising a composite metal oxide COMFIN, and
- the composite metal oxide COMFIN has a monovalent or divalent metal (but not a transition metal) or ammonia, and a transition metal in group 5 of the periodic table.
Dependencies are inferred from the claim text.