Composition for conducting material removal operations and method for forming same
AssigneeSaint-Gobain Ceramics & Plastics, Inc.
InventorsStephen Bottiglieri, Nabil Nahas, Douglas E. Ward, Chun-Lung Kuan
Life of this patent
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Abstract
A composition can comprise a carrier including a liquid and an abrasive particulate contained in the carrier, the abrasive particulate having, on average, at least 10 wt % cerium oxide in the abrasive particulate and a cerium 3+ ratio (Ce 3+/total cerium) of at least 0.1. In another embodiment, a slurry composition can comprise a liquid carrier comprising water, cerium oxide particles, and free silicate ions, wherein a material removal rate when polishing a silicon oxide wafer can be is increased by at least 3% in comparison to a slurry composition not including free silicate ions.
Claims20
A composition comprising:
- a carrier comprising a liquid;
- and
- an abrasive particulate contained in the carrier, the abrasive particulate comprises on average at least 10% cerium in the abrasive particulate and wherein the abrasive particulate comprises a cerium 3+ ratio (Ce 3+/total cerium) of at least 0.1.
A method for forming an abrasive particulate for use in an abrasive slurry comprising:
- combining a first precursor material and a second precursor material to form a mixture, wherein the first precursor material comprises cerium and the second precursor material comprises at least one metal element other than cerium;
- and
- treating the mixture in a non-oxidizing atmosphere to create an abrasive particulate comprising a cerium 3+ ratio (Ce 3+/total cerium) of at least 0.1.
A slurry composition comprising a liquid carrier comprising water, cerium oxide particles, and free silicate ions, wherein a material removal rate when polishing a silicon oxide wafer is increased by at least 3% in comparison to a slurry composition not including free silicate ions.
Dependencies are inferred from the claim text.