Abrasive, polishing composition, and polishing method
AssigneeFujimi Incorporated
InventorsHitoshi MORINAGA, Kazusei TAMAI, Maiko ASAI, Yuuichi ITO, Kyosuke TENKO, Toru KAMADA
Life of this patent
Estimating the term…
Loading patent…
AssigneeFujimi Incorporated
InventorsHitoshi MORINAGA, Kazusei TAMAI, Maiko ASAI, Yuuichi ITO, Kyosuke TENKO, Toru KAMADA
Estimating the term…
Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.
An abrasive used for polishing of a polishing object containing at least one of an alloy and a metal oxide, comprising alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less.
Dependencies are inferred from the claim text.