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US 2019/0153203 A1Published application
Resin composition and resin molded body
AssigneeFuji Xerox Co., Ltd.
InventorsYuko IWADATE, Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Daisuke NAKAYAMA
Life of this patent
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Abstract
This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.
Claims20
A resin composition comprising:
- a polyolefin;
- carbon fibers having an average fiber length of 0.1 mm to 2.5 mm;
- a resin containing at least one of an amide bond and an imide bond, a content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass;
- and
- a compatibilizer.
2 more elements
A resin molded body, comprising:
- a polyolefin;
- carbon fibers having an average fiber length of 0.1 mm to 2.5 mm;
- a resin containing at least one of an amide bond and an imide bond, a content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass;
- and
- a compatibilizer.
2 more elements
Dependencies are inferred from the claim text.