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US 2019/0153177 A1Published application
Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsYoshihiro NAKAZUMI, Daisuke UEYAMA, Kentaro TAKANO
Life of this patent
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Abstract
The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
Claims14
A resin composition comprising
- a cyanate compound (A) and/or a maleimide compound (B), and
- an inorganic filler (C), wherein
- the inorganic filler (C) comprises a boron nitride particle aggregate comprising primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
Dependencies are inferred from the claim text.