Polyimide resin, polyimide solution, film, and method for producing same
AssigneeKaneka Corporation
InventorsYasutaka KONDO, Hiroyuki USHIRO, Shoto BANYA, Makoto TAWADA
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Abstract
A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4 H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.
Claims20
A polyimide resin having a structure derived from an acid dianhydride and a structure derived from a diamine,
- wherein the acid dianhydride comprises an alicyclic acid dianhydride, and
- the diamine comprises a sulfonyl group-containing diamine.
The polyimide resin according to claim wherein the fluorine-containing aromatic diamine comprises
- a bis (trifluoromethyl) benzidine.
Dependencies are inferred from the claim text.