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US 2019/0153151 A1Published application
Thermosetting resin composition, and prepreg and substrate using same
AssigneeKolon Industries, Inc.
InventorsHee Jin CHO, Do Kyung SUNG, Sae Rom NAM
Life of this patent
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Abstract
The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
Claims9
A thermosetting resin composition comprising:
- (i) a benzoxazine-based compound having two or more allyl groups at the terminal,
- (ii) an epoxy resin having two or more epoxy rings,
- (iii) an active ester-modified curing agent and(iv) a nitrogen-based curing agent.
Dependencies are inferred from the claim text.