Structure, electronic apparatus, decorative film, and structure production method
AssigneeSony Corporation
InventorsKAZUHITO SHIMODA, ATSUHIRO ABE
Life of this patent
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Abstract
A structure according to an embodiment of the present technology includes a decorative film and a casing portion. The decorative film includes a metal layer that includes a first area in which an addition concentration of a predetermined element is relatively high, a second area in which the addition concentration is relatively lower than that of the first area, and minute cracks that are formed using the first area as a reference. The casing portion includes a to-be-decorated area to which the decorative film is to be bonded.
Claims21
A structure, comprising:
- a decorative film including a metal layer that includes a first area in which an addition concentration of a predetermined element is relatively high, a second area in which the addition concentration is relatively lower than that of the first area, and minute cracks that are formed using the first area as a reference;
- and
- a casing portion including a to-be-decorated area to which the decorative film is to be bonded.
An electronic apparatus, comprising:
- a decorative film including a metal layer that includes a first area in which an addition concentration of a predetermined element is relatively high, a second area in which the addition concentration is relatively lower than that of the first area, and minute cracks that are formed using the first area as a reference;
- a casing portion including a to-be-decorated area to which the decorative film is to be bonded;
- and
- an electronic component accommodated in the casing portion.
A decorative film, comprising:
- a base film;
- and
- a metal layer that is formed on the base film and includes a first area in which an addition concentration of a predetermined element is relatively high, a second area in which the addition concentration is relatively lower than that of the first area, and minute cracks that are formed using the first area as a reference.
A structure production method, comprising:
- forming a metal layer to which a predetermined element is added on a base film by vapor deposition;
- forming minute cracks on the metal layer by stretching the base film;
- forming a decorative film including the metal layer on which the minute cracks are formed;
- forming a transfer film by bonding a carrier film onto the decorative film;
- and
- forming a molded component such that the decorative film is transferred from the transfer film by an in-mold molding method, a hot stamp method, or a vacuum molding method.
A structure production method, comprising:
- forming a metal layer to which a predetermined element is added on a base film by vapor deposition;
- forming minute cracks on the metal layer by stretching the base film;
- forming a transfer film including the metal layer on which the minute cracks are formed;
- and
- forming a molded component such that the metal layer peeled off from the base film is transferred by an in-mold molding method, a hot stamp method, or a vacuum molding method.
A structure production method, comprising:
- forming a metal layer to which a predetermined element is added on a base film by vapor deposition;
- forming minute cracks on the metal layer by stretching the base film;
- forming a decorative film including the metal layer on which the minute cracks are formed;
- and
- forming a molded component integrally with the decorative film by an insert molding method.
Dependencies are inferred from the claim text.