Array-type electrode, digital printing mold and method for manufacturing array-type electrode
AssigneeIndustrial Technology Research Institute
InventorsWEI-YUAN CHEN, YU-MING WANG, SHENG-YU LIN, YI-WEI LIN
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Abstract
An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
Claims20
An array-type electrode, comprising:
- a substrate;
- an isolating layer, disposed on one side of the substrate;
- an electrode, wherein a first part of the electrode is disposed on one side of the substrate and covered by the isolating layer;
- a second part of the electrode penetrates through the substrate;
- a third part of the electrode is disposed on the other side of the substrate;
- the first part is connected to the third part via the second part;
- and
- a micro-structure layer, disposed on the isolating layer.
A digital printing mold, comprising an electrode array, wherein the electrode array comprises a plurality of array-type electrodes, and each of the array-type electrodes comprises:
- a substrate;
- an isolating layer, disposed on one side of the substrate;
- an electrode, wherein a first part of the electrode is disposed on one side of the substrate and covered by the isolating layer;
- a second part of the electrode penetrates through the substrate;
- a third part of the electrode is disposed on the other side of the substrate;
- the first part is connected to the third part via the second part;
- and
- a micro-structure layer, disposed on the isolating layer.
A method for manufacturing array-type electrode, comprising following steps:
- providing a substrate;
- adhering a first metal layer to one side of the substrate, and adhering a second metal layer to the other side of the substrate;
- etching the first metal layer and the second metal layer to form a driving electrode part and a conductive part respectively;
- perforating the substrate, the driving electrode part, and the conductive part to form a through hole;
- and
- executing an electroplating process to form a connection part in the through hole to connect the driving electrode part to the conductive part.
Dependencies are inferred from the claim text.