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US 2019/0134916 A1Published application
Plasticity induced bonding
AssigneeMassachusetts Institute of Technology
InventorsNikhil Padhye, David Moore Parks, Bernhardt Levy Trout, Alexander H. Slocum
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Abstract
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.
Claims8
1-19. (canceled)
An apparatus comprising:
- a pressing element constructed and arranged to apply a compressive force to a first part in contact with a second part;
- a controller in electrical communication with the pressing element, wherein the controller controls the pressing element to apply a compressive stress to the first part and the second part that is greater than a yield strength and less than an ultimate compressive strength of both the first part and the second part, and wherein the controller controls the pressing element to plastically deform the first part and the second part to a compressive plastic strain between about 1% and a compressive strain limit of both the first part and the second part.
Dependencies are inferred from the claim text.