Non-electrostatic chuck heater

Abstract

An apparatus for supporting a semiconductor wafer comprises a first disk receiving a gas in a central portion of the first disk. The gas is distributed within the first disk. A second disk is coupled above the first disk. The second disk comprises a heater and receives the gas from the first disk. A third disk is coupled above the second disk. The third disk receives the gas through the second disk. An upper surface of the third disk comprises a plurality of hemispheres protruding above the surface of the third disk. The plurality of hemispheres support the semiconductor wafer. The gas passes through the third disk and heats the wafer. Heat is conducted from the plurality of hemispheres to the wafer. The gas is heated as it passes from the second disk to the third disk the wafer is heated by contact with the heated gas.

Dependencies are inferred from the claim text.