System And Method For Minimizing Backside Workpiece Damage
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorScott E. Peitzsch
Life of this patent
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Abstract
A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.
Claims18
A system for minimizing damage to a workpiece during thermal transitions, comprising:
- a platen comprising a top surface having one or more openings;
- a plurality of conduits, each of the plurality of conduits in communication with a respective opening;
- a valving system in communication with the plurality of conduits and in communication with a back side gas supply system;
- one or more electrodes disposed in the platen to create a clamping force to hold the workpiece to the top surface;
- an electrode power supply;
- and
- a controller, in communication with the valving system to modulate a flow of backside gas to the top surface of the platen and in communication with the electrode power supply to modulate the clamping force applied to the workpiece.
A non-transitory computer readable storage medium, comprising instructions, which, when executed by a controller, cause the controller to:
- modulate a clamping force applied to a workpiece disposed on a platen;
- and
- modulate a flow of backside gas to a top surface of the platen while the workpiece is disposed on the platen.
A method of minimizing damage to a workpiece during thermal transitions, comprising:
- disposing a workpiece on a heated platen;
- modulating a clamping force and a flow of backside gas to a top surface of the heated platen while the workpiece is disposed on the heated platen;
- and
- removing the workpiece when the workpiece reaches a desired temperature.
Dependencies are inferred from the claim text.