Data management and mining to correlate wafer alignment, design, defect, process, tool, and metrology data

A computing system, comprising:

• a memory;
• and
• a processor configured to perform a method for improving silicon wafer manufacturing, the method comprising:
• receiving information describing a defect;
• identifying a critical area of a silicon wafer;
• determining the probability of the defect occurring in the critical area;
• determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area;
• and
• providing, based on the likelihood, predictive information to a manufacturing system, wherein corrective action is taken based on the predictive information in order to improve silicon wafer manufacturing.

A non-transitory computer-readable medium comprising instructions that when executed by a computing device cause the computing device to perform a method for improving silicon wafer manufacturing, the method comprising:

• receiving information describing a defect;
• identifying a critical area of a silicon wafer;
• determining the probability of the defect occurring in the critical area;
• determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area;
• and
• providing, based on the likelihood, predictive information to a manufacturing system, wherein corrective action is taken based on the predictive information in order to improve silicon wafer manufacturing.