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US 2019/0121235 A1Published application
Photo-curable and thermo-curable resin composition and cured product thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGeum-Hee YUN, Hwa-Young LEE, Seol-Ah CHONG
Life of this patent
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Abstract
A photo-curable and thermo-curable resin composition includes an epoxy resin including an epoxy group; a carboxyl group-containing photosensitive resin; a photopolymerization initiator; and a filler, wherein a value of an equivalent number of the epoxy group/an equivalent number of the carboxyl group is from more than 1 to less than 2.
Claims20
A photo-curable and thermo-curable resin composition comprising:
- an epoxy resin comprising an epoxy group;
- a carboxyl group-containing photosensitive resin;
- a photopolymerization initiator;
- and
- a filler,
- wherein a value of an equivalent number of the epoxy group/an equivalent number of the carboxyl group is from more than 1 to less than 2.
3 more elements
A method of making a substrate comprising a via hole, comprising:
- mixing an epoxy resin comprising an epoxy group, a carboxyl group-containing photosensitive resin, a photopolymerization initiator, and a filter to form a photo-curable and thermo-curable resin, wherein a value of an equivalent number of the epoxy group to an equivalent number of the carboxyl group is in a range from greater than 1 to less than 2;
- spreading the photo-curable and thermo-curable resin to form a product;
- and
- forming a via hole in the product.
1 more element
Dependencies are inferred from the claim text.