Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole
AssigneeAGC Inc.
InventorMotoshi ONO
Life of this patent
Estimating the term…
Abstract
Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ (1), and 0.16≤sin θ≤0.22 (2).
Claims17
1-19. (canceled)
A glass substrate provided with a through-hole, wherein the through-hole comprises a first opening edge at a first surface of the glass substrate and a second opening edge at a second surface opposite to the first surface of the glass substrate,
- wherein the second opening edge is smaller than the first opening edge, and
- wherein at any position of the through-hole in a plate thickness direction, a ratio (Φ1/Φ2) between a diameter (Φ1) of the through-hole and a diameter (Φ2) of a circular truncated cone, surfaces of the circular truncated cone comprising the first opening edge and the second opening edge, is greater than or equal to 0.7 and less than or equal to 1.1.
Dependencies are inferred from the claim text.