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US 2019/0115182 A1Published application
Fuse pad, printed circuit board having the fuse pad, and method of the printed circuit board
AssigneeMando Corporation
InventorSe Gyun LEE
Life of this patent
Estimating the term…
Abstract
Disclosed are a fuse pad, a printed circuit board having the fuse pad, and a method of manufacturing the printed circuit board. The fuse pad includes a first pad provided at one side of a fuse, a second pad provided at an opposite side of the fuse, and a measurement pad electrically connected to the second pad to measure whether the fuse is detached.
Claims12
A fuse pad comprising:
- a first pad provided at one side of a fuse;
- a second pad provided at an opposite side of the fuse;
- and
- a measurement pad electrically connected to the second pad to measure whether the fuse is detached.
1 more element
A printed circuit board comprising:
- a substrate material;
- a first pad provided at one side of a fuse, at one side of the substrate material to protect the one side of the substrate material;
- a second pad provided at an opposite side of the fuse, at an opposite side of the substrate material to protect the opposite side of the substrate material;
- and
- a measurement pad electrically connected to the second pad to measure whether the fuse is detached.
2 more elements
A method of manufacturing a printed circuit board, the method comprising:
- forming a first pad and a second pad at one side and an opposite side of a substrate material while protecting the one side and the opposite side of the substrate material;
- forming a measurement pad to be electrically connected to the second pad to measure whether a fuse is detached;
- and
- forming the fuse on the first pad and the second pad.
1 more element
Dependencies are inferred from the claim text.