Component mounter and method for manufacturing mounting board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorSHIGERU SUENO
Life of this patent
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Abstract
There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.
Claims11
A component mounter that performs pressure-bonding of a plurality of components placed on a board, to the board, the component mounter comprising:
- a board holder that holds the board and lifts and lowers the held board;
- a plurality of backups that support at least one of the plurality of components placed on the held board, from a side below the board and are each provided with a suction port which suctions an undersurface of the board;
- a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups;
- and
- at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.
A method for manufacturing a mounting board, the method comprising:
- a board holding step of holding a board by using a board holder;
- a board lowering step of lowering the held board and placing the board onto a plurality of backups that support at least one of a plurality of components placed on the board from a side below the board;
- a board suctioning step of performing vacuum-sucking by suction ports provided in the plurality of backups and suctioning an undersurface of the board;
- and
- a component pressure-bonding step of pressure-bonding the plurality of components placed on the suctioned board, to the board, by using at least one pressure-bonding head.
Dependencies are inferred from the claim text.