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US 2019/0104644 A1Published application
Electronic device
AssigneeFujitsu Limited
InventorsHIROMU SHOJI, Katsuki Sawada
Life of this patent
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Abstract
An electronic device includes a casing, circuit boards disposed in the casing, heat-producing components mounted over the circuit boards, outer fins protruding toward the outside of the casing, and inner fins coupled to an inner surface of the casing, the inner fins being disposed in a space adjacent to areas in which the circuit boards are not mounted in the casing, wherein heat of the heat-producing components absorbed by the inner fins is dissipated to the outside of the casing through the outer fins.
Claims9
An electronic device comprising:
- a casing;
- circuit boards disposed in the casing;
- heat-producing components mounted over the circuit boards;
- outer fins protruding toward the outside of the casing;
- and
- inner fins coupled to an inner surface of the casing, the inner fins being disposed in a space adjacent to areas in which the circuit boards are not mounted in the casing,
- wherein heat of the heat-producing components absorbed by the inner fins is dissipated to the outside of the casing through the outer fins.
4 more elements
Dependencies are inferred from the claim text.