Mid-spreader for stacked circuit boards in an electronic device

(canceled)

(canceled)

A mid-spreader for use in an electronic device, comprising:

• a heat conductive material formed in a shape based on a first circuit board with Radio Frequency (RF) components and a second circuit board with power components between which the mid-spreader is disposed, wherein the second circuit board comprises one or more components in which the heat conductive material is in contact with to act as a heat sink, wherein the shape is formed with indentations and the shape provides for Electromagnetic interference (EMI) mitigation around a portion of the one or more components, and wherein the mid-spreader is formed with two or more Electromagnetic Interference (EMI) cavities on one side of the mid-spreader facing the first circuit board;
• and
• one or more thermal connections between the heat conductive material and one or more heat sinks in the electronic device, the mid-spreader is integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board or the second circuit board to conduct and transfer heat therefrom.

(canceled)