Integrating josephson amplifiers or josephson mixers into printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsBaleegh Abdo, Nicholas T. Bronn, Oblesh Jinka, Salvatore B. Olivadese
Life of this patent
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Abstract
An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
Claims25
A printed circuit board (PCB) comprising:
- one or more board layers;
- and
- a first chip cavity formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity;
- wherein the first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers;
- wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.
A printed circuit board (PCB) comprising:
- a dielectric substrate;
- and
- a first chip cavity and a second chip cavity formed within the dielectric substrate, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity and a second Josephson amplifier or Josephson mixer is disposed within the second chip cavity;
- wherein each of the Josephson amplifiers or Josephson mixers comprises at least one port, each port electronically coupled to at least one connector;
- and
- wherein each of the at least one connector is disposed on the dielectric substrate.
A printed circuit board (PCB) comprising:
- one or more board layers;
- a first chip cavity and a second chip cavity formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity and a second Josephson amplifier or Josephson mixer is disposed within the second chip cavity;
- and
- a coupler disposed on at least one of the one or more board layers, wherein the coupler comprises a first leg and a second leg;
- wherein the first leg is electronically coupled to the first Josephson amplifier or Josephson mixer and the second leg is electronically coupled to the second Josephson amplifier or Josephson mixer.
A method of forming a circuit board, comprising:
- providing one or more board layers;
- forming a first chip cavity within the one or more board layers, wherein the first chip cavity is operable to receive a Josephson amplifier or Josephson mixer;
- disposing a Josephson amplifier or Josephson mixer into the first chip cavity;
- and
- disposing at least one connector on at least one of the one or more board layers.
A method of forming a circuit board comprising:
- providing a dielectric substrate;
- forming a first chip cavity and a second chip cavity within the dielectric substrate, wherein the first chip cavity is operable to receive a first Josephson amplifier or Josephson mixer, and the second chip cavity is operable to receive a second Josephson amplifier or Josephson mixer;
- disposing the first Josephson amplifier or Josephson mixer into the first chip cavity;
- disposing the second Josephson amplifier or Josephson mixer into the second chip cavity;
- and
- disposing at least one connector on the dielectric substrate.
Dependencies are inferred from the claim text.