Polymer matrix composite for eliminating skew and fiber weave effect
AssigneeIteq Corporation
InventorTARUN AMLA
Life of this patent
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Abstract
The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.
Claims12
A polymer matrix composite, comprising:
- a polymeric resin;
- and
- a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003.
A prepreg comprising a resin portion that is partially cured and impregnated with a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003.
Dependencies are inferred from the claim text.