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US 2019/0104608 A1Published application
Heat-removal assemblies with opposing springs
AssigneeApple Inc.
InventorsKristopher P. Laurent, Brett W. Degner
Life of this patent
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AssigneeApple Inc.
InventorsKristopher P. Laurent, Brett W. Degner
Estimating the term…
Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.
An electronic device comprising:
The electronic device of clam 1, wherein:
An assembly for pressing a heat-dissipating assembly against a heat-generating assembly that is positioned on a first board surface of a board comprising a passageway between the first board surface and a second board surface, the fastener assembly comprising:
A method for using a heat-dissipating assembly and a spring assembly to remove heat from a heat-generating assembly positioned on a first support structure surface of a support structure that also comprises a second support structure surface, the method comprising:
Dependencies are inferred from the claim text.